Huawei is clearly focused on improving the performance of its flagship phones. The P9 and its Kirin 955 SoC performed well in our tests, being smooth and fast during day-to-day use. For the P10 and P10 Plus, Huawei tweaked the underlying hardware and software to make them perform better over longer periods of time.
Huawei’s EMUI software includes several features to make the system feel more responsive. The /data partition uses the F2FS file system to improve storage performance, and Huawei’s new “machine learning algorithm” prioritizes system resources (CPU, memory, and storage) to improve the response speed and performance of foreground applications. Huawei also uses compression to increase the amount of data held in working memory.
The new phone is powered by HiSilicon’s Kirin 960 SoC, which comes in a big.LITTLE arrangement consisting of four ARM Cortex-A73 CPUs and four Cortex-A53 CPUs. When we looked at the Kirin 960 earlier this year, we found that its A73 core had higher integer IPC than the Kirin 950/955’s A72 core, but floating point IPC was generally down. Kirin 960 also features improvements to the memory subsystem. Although our low-level testing results were mixed, the Kirin 960 used in the Huawei Mate 9 performed well when running common workloads like web browsing and photo editing.
In addition to the new CPU, the Kirin 960 also includes a significantly upgraded GPU. The Mali-G71MP8 has twice the core count of the Mali-T880MP4 GPU in the Kirin 950/955. It’s also based on ARM’s new Bifrost architecture, which features several improvements over the previous Midgard architecture to help improve shader core utilization. Like other OEMs, Huawei is currently working on sourcing some other internal components, particularly NAND and RAM – which can impact overall system performance. Samsung, SK Hynix and Toshiba said they are struggling to produce enough flash memory in the face of increased demand, especially for higher-density modules, and problems boosting 3D NAND production. This shortage also applies to DRAM, which began in 2016 and will likely continue through the remainder of 2017.
Huawei confirmed it was sourcing memory components from multiple suppliers due to supply shortages and rising component costs and said it had never committed to any specific type of NAND.
In fact, P10 users claim that some devices use eMMC instead of UFS NAND, as well as LPDDR3 and LPDDR4 RAM. In fact, among smartphone OEMs, especially large OEMs such as Apple, Huawei, LG, and Samsung, multi-sourcing for many different components including NAND, RAM, display panels, modem/RF, and camera sensors It’s actually quite common. Apple even sources SoCs from different foundries. However, problems can arise if the OEM does not hold its suppliers to the same standards and allows for huge differences in performance between parts from different suppliers, which unfortunately happens all too often. Based on Huawei’s official statement, we have no way of knowing who its suppliers are, what components they are or are not using (LPDDR3/LPDDR4, eMMC/UFS), or how many phones are using potentially slower components. It simply says that component selections are randomly chosen based on current availability, and consumers have no way of knowing what they’re buying until they open the box.
In this report, we’ll identify the components used in our P10 and P10 Plus review devices, then run them through a series of tests to assess day-to-day performance and battery life. Huawei was able to extend the battery life of the Huawei Mate 9 Cell Phone Batteryover the previous generation, so it will be interesting to see if the same is true for the P10.
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